Surface mount technology (SMT), renowned for its high-density assembly and efficient production, is a core process in modern electronics manufacturing. As components continue to miniaturize, mounting precision demands are becoming increasingly stringent. As the cornerstone of electronic components, the performance and quality of printed circuit boards (PCBs) directly determine the stability and reliability of finished SMT products.

In SMT production, insufficient surface wettability often leads to solder paste printing defects such as buildup, stringing, uneven penetration, or offset, resulting in poor soldering. SINDIN plasma treatment technology significantly enhances PCB surface energy and wettability, effectively improving solder paste wetting and adhesion, reducing solder joint defect rates, and improving overall yield.

With the widespread use of electronic components in high-end applications such as automotive electronics and aerospace, PCBs must also possess high-temperature resistance, corrosion resistance, and aging resistance. Therefore, conformal coating has become essential. Applying a plasma treatment before coating cleans and activates the circuit board surface, ensuring uniform coating and preventing delamination, bubbles, and unevenness, thus ensuring long-term stable operation in harsh environments.

SINDIN plasma solutions help customers improve quality in every key link from welding to coating, achieving a perfect combination of efficient production and high reliability.