As display technology continues to advance toward higher resolution, narrow bezels, flexibility, and high reliability, FPD manufacturing processes place increasingly stringent requirements on substrate surface cleanliness, surface energy, and adhesion. Whether for LCD, OLED, or Mini/Micro LED displays, surface treatment is critical to ensuring process stability and finished product quality. Plasma surface treatment technology is an effective solution to these problems.

ITO Glass and Substrate Cleaning

In TFT-LCD and OLED production, organic matter or tiny particles often remain on the surface of ITO glass, hindering subsequent photolithography, coating, and lamination processes. Plasma cleaning removes contaminants while activating the substrate surface, improving the adhesion of photoresist and thin film layers, and ensuring pattern transfer and film uniformity.

Alignment Layer Treatment

The alignment layer used in liquid crystal displays requires uniform and stable surface properties. Plasma can be used to modify the surface of the alignment layer, increasing its surface energy and uniformity, thereby improving the alignment of liquid crystal molecules and enhancing contrast and display quality.

OLED/Encapsulation

In OLED manufacturing, the encapsulation layer must bond well with the substrate and organic light-emitting layer to prevent moisture and oxygen infiltration. Plasma treatment can improve the adhesion between the encapsulation material and the substrate, preventing delamination and permeation, and extending device life.

Polarizer and Optical Film Lamination

The lamination of optical films such as polarizers, brightness enhancement films, and diffusers requires extremely high surface cleanliness and wettability. Plasma cleaning and activation can improve the bonding between the film and the glass/substrate, reducing bubbles, delamination, and poor lamination.

Mini/Micro LED Display Encapsulation

In emerging display technologies, Mini/Micro LED chips are small and numerous, requiring extremely precise placement and transfer processes. Plasma treatment can improve substrate surface wettability and adhesion, ensuring consistency in chip dispensing, soldering, and lamination processes, thereby enhancing display uniformity and yield.