Dynetech ESD Protection system

How to remove static electricity in film industry

Everywhere static electricity~

Before chip packaging, microwave PLASMA is used to clean the devices, which can increase their surface activity, reduce packaging gaps, and enhance their electrical performance.

In wire bonding technology, do you suffer from "bonding separation"?

Die Bonding is to assemble the chip to the substrate or frame. Commonly used methods include eutectic welding, silver glue bonding, lead-tin alloy welding, etc.