Unique design of the sample stage, specially designed for wafers；
Can meet 6-12 inch wafer samples for testing；
Matrix multi-point test, accurate and convenient test；
Measure 50 points at one time, display the data directly in the original image and save it；
Product description
Specification parameters
Hardware options
SDC-500W contact angle measuring instrument is a set of automatic wafer contact angle measurement and analysis equipment tailored for wafer wafer customers. The point test can measure more than 50 points at one time, and can export the data spectrum with one click, which is widely used in the research of the wetting performance of wafer materials.
Working Principle
Industry Application
Specific Solutions
Measure the wetting behavior of liquid on the surface of wafer material, such as spreading, penetration, absorption, etc., measure static and dynamic contact angle, measure and analyze the surface free energy of solid, interface and surface tension of liquid, fully automatic injection system, advancing and retreating angle, rolling Sliding corners and other comprehensive functions.
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